As with all our stencils, we provide nearly all frame sizes custom made to suit your requirements.
Multi-level Stencils
Multi-level stencils are an invaluable solution for a number of applications , such as assemblies requiring different foil thickness due to a mixture of component sizes, coplanarity issues through-hole reflow, epoxy / paste applications among others. Contact us to find out how multi-level stencils can help your project.
Mini- Stencils
Used for placing solder paste on the pads of components being reworked. ETS has the capability of creating REWORK STENCILS for all types of components like BGA, using either Gerber Data or mechanical drawings.
Reballing Fixtures
An Economical tool for reballing BGA’s during the rework process, saving our customers both time and money.
Metal Squeegee Blades
With extensive experience, we at ETS can design and manufacture good quality Squeeze Blades for consistent fine pitch printing ability.
Inspection Templates
An invaluable tool in the INSPECTION of printed circuit boards for MISSING or MISALIGNED components. All these templates are ANTI-STATIC coated. Contact us to find out how inspection templates can help your production.
Stencil Aperture Design
Dogbone Opening
A modification that can be applied in two different situations. For fine pitch, it reduces solder in the middle of the pad to reduce bridging but gives more volume on the ends for good fillets. It can also be used when re flowing double side SMT connectors.
Homebase Openings
The most common shape used when trying to keep paste away from the components body in order to eliminate solder balls when using a no-clean solder paste.
Step Down / Multilevel
The only cost / time effective method of printing different paste heights using the same stencil. Commonly used when dealing with BGA’s to prevent coplanarity issues.
Epoxy Designs
Stencils openings are designed to deposit just the right amount of glue to hold the components during wave solder process.
